25100445
DOWC25100445EA
756
EUR
InStock
DOWC25100445
SYLGARD® 184
SYLGARD® 184
Dow silicone 10 to 1 encapsulants are supplied as two-part liquid component kits. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/PCB system assembly applications. Dow silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement.
- Flowable
- Room temperature and heat cure
- Good dielectric properties
- Rapid, versatile cure processing controlled by temperature
- High transparency allows easy inspection of components
The 10 to 1 mix ratio these products are supplied in gives one latitude to tune the modulus and hardness for specific application needs and production lines. In most cases de-airing is not required.